
| Items |
R233 Film-PTFE Enhanced High Modulus Backing Substrates |
R253 Film-PTFE Enhanced High Modulus Backing Substrates |
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| Color | N/A Gray | |||
| Adhesive System | N/A A | N/A S | ||
| Backing Thickness | N/A 5.0 mil0.125 mm | |||
| Adhesive Thickness | N/A 1.5 mil0.038 mm | |||
| Total Thickness | N/A 6.5 mil0.165 mm | |||
| Adhesion Strength | N/A 30 oz/in331 g/cm | N/A 40 oz/in441 g/cm | ||
| Tensile Strength | N/A 75 lb/in13.0 kg/cm | |||
| Elongation | N/A 150 % | N/A 110 % | ||
| Dielectric | N/A 9.5 kV | N/A 11.0 kV | ||
| Insulation Class | N/A 130 ºC | N/A | ||
| Min Temperature Range | N/A -40 ºF-40 ºC | N/A -100 ºF-73 ºC | ||
| Max Temperature Range | N/A 350 ºF177 ºC | N/A 500 ºF260 ºC | ||
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