Item # SE 9186 L Clear, Electronics Adhesive Sealants On Robert McKeown Co., Inc.

Translucent; 1 part – no mixing required; moisture cure (RTV) – no oven required; solvent-free – no ventilation required; fast tack-free time for faster in-line processing; cure can also be heat accelerated; low viscosity for quick flow/fill/self-leveling after dispensing process; controlled volatility – reducing the potential of volatiles affecting surrounding components

Unit of Measure

Specifications | Features | Potential or Typical Uses

Specifications

Type	N/A One-Part Moisture Cure RTV
One or Two Part	N/A 1
Color	N/A Translucent
Viscosity/Flowability	N/A 26900
Durometer	N/A 24 JIS A
Tensile Strength	N/A 190 psi1.3 MPa13 kgf/cm²
Elongation	N/A 310 %
Specific Gravity	N/A 1.02
Room Temperature Tack-Free Time	N/A 8 min
Room Temperature Cure Time	N/A 48 h
Unprimed Adhesion Lap Shear	N/A 96 psi66 N/cm²6.7 kgf/cm²
Shelf Life from Date of Manufacture	N/A 15 months at < 32 ºC
Dielectric Strength	N/A 575 V/mil23 kV/mm
Dielectric Constant at 1 MHz	N/A 2.7
Dissipation Factor at 1 MHz	N/A 1.30E-03
Volume Resistivity	N/A 6.0E+15 O/cm
Agency Listing	N/A NA

Features

N/A
Fast tack-free RT cure; flowable; controlled silicone volatility; no added solvents

Potential or Typical Uses

N/A
Parts fixing on circuit boards; LCD module assembly

Specifications

Type

One or Two Part

Color

Viscosity/Flowability

Durometer

Tensile Strength

Elongation

Specific Gravity

Room Temperature Tack-Free Time

Room Temperature Cure Time

Unprimed Adhesion Lap Shear

Shelf Life from Date of Manufacture

Dielectric Strength

Dielectric Constant at 1 MHz

Dissipation Factor at 1 MHz

Volume Resistivity

Agency Listing

Features

Potential or Typical Uses