Print Back
Bond line thickness should not exceed 8 mils Primer promotes adhesion
Unit of Measure

Specifications

Filler

Ag/Cu

Resin Type (Parts)

silicone (2)

Specific Gravity

3.0 g/cc

Max. Volume Resistivity

0.060 O/cm

Lap Shear Min.

450 psi3103 kPa

Elevated Temperature Cure Cycle Time

0.5 h at 250 oF (121 oC)

RT Cure Time

168 h

Working Life

2 h

Shelf Life at RT (Mos.)

6

Recommended Primer

1086 (Primer included with product)

Application

EMI gasket attachment