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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

Lead free, solder alternative, screen and stencil printing.
Unit of Measure

Specifications

Max. Volume Resistivity

N/A 5 x 10-4 O/cm

Certified to MIL-STD-883, Method 5011

N/A No

Viscosity

N/A 54000 cps

Work Life at Room Temperature

N/A 18 h

Cure

N/A 10 min at 150 ºC

Secondary Cure Option

N/A 15 min at 125 ºC

Lap Shear Strength

N/A 1200 psi

Die Shear Strength

N/A > 2 kg

Conductivity

N/A 1.8 W/m·K

Tg

N/A 109 ºC

CTE Below Tg

N/A 46 ppm/ºC

CTE Above Tg

N/A 160 ppm/ºC