Print Back
Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

High purity, die attach adhesive
Unit of Measure

Specifications

Max. Volume Resistivity

9 x 10-4 O/cm

Certified to MIL-STD-883, Method 5011

Yes

Viscosity

60000 cps

Work Life at Room Temperature

3 days

Cure

30 min at 150 ºC

Die Shear Strength

3500 psi

Conductivity

4.5 W/m·K

Tg

117 ºC

CTE Below Tg

52 ppm/ºC

CTE Above Tg

150 ppm/ºC