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General purpose, very thick paste, fast heat/RT cure, < 0.254 mm bond lines.
Unit of Measure

Specifications

Filler

Ag/Cu

Resin Type (Parts)

epoxy (2)

Specific Gravity

5.0 g/cc

Max. Volume Resistivity

0.005 O/cm

Lap Shear Min.

1600 psi11032 kPa

Elevated Temperature Cure Cycle Time

2 h at 150 °F (66 ºC)

RT Cure Time

24 h

Working Life

1 h

Shelf Life at RT (Mos.)

9

Application

EMI gasket attachment, bonding enclosures