Robert McKeown Co., Inc. - Dow Electronics Thermally Conductive Adhesives/Sealants

Thermally Conductive Materials
Long-term, reliable protection of sensitive circuits and components is important in many of today’s delicate and demanding electronic applications. With the increase in processing power and the trend toward smaller, more compact electronic modules, the need for thermal management is growing. Dow’s family of thermally conductive materials provides excellent thermal management options. Thermally conductive silicones function as heat transfer media, durable dielectric insulation, barriers against environmental contaminants and as stress-relieving shock and vibration absorbers over a wide temperature and humidity range.

In addition to sustaining their physical and electrical properties over a broad range of operating conditions, silicones are resistant to ozone and ultraviolet degradation and have good chemical stability. Dow’s line of thermal management materials includes adhesives, encapsulants, compounds and gels.

Good heat transfer is dependent on a good interface between the heat producing device and the heat transfer media. Silicones have a low surface tension that enables them to wet most surfaces, which can lower the thermal contact resistance between the substrate and the material.

Unit of Measure

Items	SE4422 Adhesive Dow Electronics Thermally Conductive Adhesives/Sealants	SE9184 CV Adhesive Dow Electronics Thermally Conductive Adhesives/Sealants	SE4450 Adhesive Dow Electronics Thermally Conductive Adhesives/Sealants	1-4173 Adhesive Dow Electronics Thermally Conductive Adhesives/Sealants	1-4174 Adhesive Dow Electronics Thermally Conductive Adhesives/Sealants
Type	N/A Thermally Conductive Adhesives
Product Form	N/A One-Part
Color	N/A Gray	N/A White	N/A Gray	N/A Gray	N/A Gray
Viscosity	N/A 200000 mPa/s	N/A Non-flow	N/A 61000 mPa/s	N/A 58000 mPa/s	N/A 58000 mPa/s
Durometer	N/A 69 A	N/A 72 A	N/A 95 A	N/A 92 A	N/A 92 A
Penetration (1/10 of mm)	N/A
Tensile Strength	N/A 754 psi5.2 MPa53 kgf/cm²	N/A 421 psi2.9 MPa29.6 kgf/cm²	N/A 1044 psi7.2 MPa73.4 kgf/cm²	N/A 900 psi6.2 MPa63.3 kgf/cm²	N/A 900 psi6.2 MPa63.3 kgf/cm²
Elongation	N/A 120 %	N/A 70 %	N/A 40 %	N/A 20 %	N/A
Specific Gravity	N/A 2.17	N/A	N/A 2.74	N/A 2.7	N/A 2.71
Compression Modulus at 10 %	N/A
Linear CTE	N/A 203 µ/mC	N/A	N/A	N/A 126 µ/mC	N/A
Working Time at Room Temperature¹	N/A < 10 min	N/A	N/A	N/A	N/A
Room Temperature Cure Time²	N/A 144 h	N/A 48 h	N/A	N/A	N/A
Heat Cure Time at 100 ºC (212 ºF)³	N/A	N/A	N/A	N/A 90 min	N/A 90 min
Heat Cure Time at 120 ºC	N/A
Heat Cure Time at 125 ºC (257 ºF)⁴	N/A	N/A	N/A	N/A 30 min	N/A 30 min
Heat Cure Time at 150 ºC (302 ºF)⁵	N/A	N/A	N/A 30 min	N/A 20 min	N/A 20 min
Unprimed Adhesion Lap Shear	N/A 230 psi160 N/cm²16 kgf/cm²	N/A 300 psi205 N/cm²21 kgf/cm²	N/A 530 psi365 N/cm²37 kgf/cm²	N/A 640 psi440 N/cm²45 kgf/cm²	N/A 590 psi405 N/cm²41 kgf/cm²
Thermal Conductivity⁶	N/A 0.9 W/m·K	N/A 0.84 W/m·K	N/A 1.97 W/m·K	N/A 1.9 W/m·K	N/A 1.9 W/m·K
Shelf Life from Date of Manufacture	N/A 9 months	N/A 7 months	N/A 6 months	N/A 6 months at 5 ºC	N/A 6 months at 5 ºC
Dielectric Strength	N/A 365 V/mil14.3 kV/mm	N/A 508 V/mil20 kV/mm	N/A 610 V/mil24 kV/mm	N/A 425 V/mil16.7 kV/mm	N/A 425 V/mil16.7 kV/mm
Dielectric Constant at 100 Hz	N/A 4.44	N/A	N/A	N/A 4.98	N/A
Dielectric Constant at 1 kHz	N/A
Dielectric Constant at 100 kHz	N/A 4.38	N/A	N/A	N/A 4.86	N/A 4.63
Dielectric Constant at 1 MHz	N/A 4.9	N/A 3.9	N/A 4.7	N/A	N/A
Dissipation Factor at 100 Hz	N/A 0.00498	N/A	N/A	N/A 0.008	N/A
Dissipation Factor at 1 kHz	N/A
Dissipation Factor at 100 kHz	N/A 0.00498	N/A	N/A	N/A < 0.003	N/A 0.0021
Dissipation Factor at 1 MHz	N/A 0.006	N/A 0.002	N/A 0.002	N/A	N/A
Volume Resistivity	N/A 5.00E+15 O/cm	N/A 1.00E+15 O/cm	N/A 2.00E+15 O/cm	N/A 2.20E+14 O/cm	N/A 1.90E+14 O/cm
¹ Time to double initial mixed viscosity. ² Cure time for 3 mm thickness at 20 °C (68 °F) and 55 % relative humidity. ³ Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature. ⁴ Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature. ⁵ Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature. ⁶ Thermal Conductivity at 25 ºC (77 ºF)