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Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100°F to +500°F (-73°C to +260°C). These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.
Film-Polyimide Backing Substrates
Unit of Measure
Items Film-Polyimide Backing Substrates
2345-1
Film-Polyimide Backing Substrates
Film-Polyimide Backing Substrates
2345-2
Film-Polyimide Backing Substrates
Film-Polyimide Backing Substrates
2345-5
Film-Polyimide Backing Substrates
Film-Polyimide Backing Substrates
K104
Film-Polyimide Backing Substrates
Film-Polyimide Backing Substrates
K201
Film-Polyimide Backing Substrates
Color N/A Amber
Adhesive System N/A S
Backing Thickness N/A 1.0 mil0.025 mm N/A 2.0 mil0.051 mm N/A 5.0 mil0.127 mm N/A 0.5 mil0.013 mm N/A 1.0 mil0.025 mm
Adhesive Thickness N/A 1.5 mil0.038 mm N/A 1.5 mil0.038 mm N/A 1.5 mil0.038 mm N/A 1.0 mil0.025 mm N/A 1.5 mil0.038 mm
Total Thickness N/A 2.5 mil0.064 mm N/A 3.5 mil0.089 mm N/A 6.5 mil0.165 mm N/A 1.5 mil0.038 mm N/A 2.5 mil0.064 mm
Adhesion Strength N/A 25 oz/in276 g/cm N/A 25 oz/in276 g/cm N/A 20 oz/in221 g/cm N/A 15 oz/in165 g/cm N/A 25 oz/in276 g/cm
Tensile Strength N/A 30 lb/in5.4 kg/cm N/A 50 lb/in8.9 kg/cm N/A 150 lb/in26.8 kg/cm N/A 10 lb/in1.8 kg/cm N/A 30 lb/in5.4 kg/cm
Elongation N/A 50 % N/A 75 % N/A 75 % N/A 25 % N/A 50 %
Dielectric N/A 6.5 kV N/A 10.0 kV N/A 17.0 kV N/A 4.0 kV N/A
Insulation Class N/A 180 ºC
Min Temperature Range N/A -100 ºF-73 ºC
Max Temperature Range N/A 500 ºF260 ºC
Comments N/A UL Guide OANZ2,File E66639,UL510 N/A UL Guide OANZ2,File E66639,UL510 N/A N/A N/A Masking grade