Print Back
FEP film is used for applications requiring optical clarity, quick release, and abrasion resistance. FEP film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Film-FEP Backing Substrates
Unit of Measure
Items Film-FEP Backing Substrates
C
Film-FEP Backing Substrates
Film-FEP Backing Substrates
2355-2
Film-FEP Backing Substrates
Color N/A Clear
Adhesive System N/A S
Backing Thickness N/A 2.0 mil0.051 mm
Adhesive Thickness N/A 1.5 mil0.038 mm
Total Thickness N/A 3.5 mil0.089 mm
Adhesion Strength N/A 20 oz/in220 g/cm
Tensile Strength N/A 8 lb/in1.4 kg/cm
Elongation N/A 275 %
Dielectric N/A 9.0 kV
Insulation Class N/A 155 ºC
Min Temperature Range N/A -100 ºF-73 ºC
Max Temperature Range N/A 400 ºC204 ºF
Comments N/A Food/Medical Grade N/A