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Electronics Potting & Encapsulation
Electronics Potting & Encapsulation
Epoxy Encapsulant Product
Epoxy Encapsulant Product
Item # 5954
Item # 5954, Epoxy Encapsulant Product
5954
Epoxy Encapsulant Product
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Silicone, high temperature, easy mix ratio
Unit of Measure
Imperial
Metric
Both
Specifications
|
Handling
|
Physical
|
Thermal
|
Electrical
Specifications
Type
N/A
Thermally Conductive
Catalyst
N/A
Part B
Handling
Viscosity at 25 ºC
N/A
35000 cps
Mix Ratio (wt)
N/A
100:100
Cure Schedule
N/A
Room
Physical
Specific Gravity
N/A
2.45 g/cc
Hardness
N/A
85 A
Tensile Strength
N/A
400 psi
Thermal
CTE
N/A
150 ppm/ºC
Thermal Conductivity
N/A
1.15 W/m·K
Service Temperature
N/A
–65 to 260 ºC
Electrical
Dielectric Strength
N/A
40 V/mil
Dielectric Constant at 1 MHz
N/A
5.0
Volume Resistivity at 25 ºC
N/A
1 x 10
14
O/cm