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Electronics Potting & Encapsulation
Electronics Potting & Encapsulation
Epoxy Encapsulant Product
Epoxy Encapsulant Product
Item # 4954
Item # 4954, Epoxy Encapsulant Product
4954
Epoxy Encapsulant Product
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Silicone, high temperature
Unit of Measure
Imperial
Metric
Both
Specifications
|
Handling
|
Physical
|
Thermal
|
Electrical
Specifications
Type
N/A
Thermally Conductive
Catalyst
N/A
50
Handling
Viscosity at 25 ºC
N/A
40000 cps
Mix Ratio (wt)
N/A
100:0.1–0.4
Cure Schedule
N/A
Room
Physical
Specific Gravity
N/A
2.30 g/cc
Hardness
N/A
80 A
Tensile Strength
N/A
525 psi
Thermal
CTE
N/A
157 ppm/ºC
Thermal Conductivity
N/A
1.3 W/m·K
Service Temperature
N/A
–65 to 260 ºC
Electrical
Dielectric Strength
N/A
520 V/mil
Dielectric Constant at 1 MHz
N/A
5.03
Volume Resistivity at 25 ºC
N/A
1 x 10
14
O/cm