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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

Two components, general purpose, room temperature cure.
Unit of Measure

Specifications

Max. Volume Resistivity

0.02 O/cm

Certified to MIL-STD-883, Method 5011

No

Viscosity

200000 cps

Work Life at Room Temperature

60 min

Cure

24 h at 25 ºC

Secondary Cure Option

1 h at 120 ºC

Lap Shear Strength

1000 psi

Conductivity

2 W/m·K

Tg

100 ºC