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General purpose, very thick paste, requires no contact pres sure for cure and is less conductive.
Unit of Measure

Specifications

Filler

Ag, Ag/Cu

Resin Type (Parts)

epoxy (2)

Specific Gravity

4.0 g/cc

Max. Volume Resistivity

0.010 O/cm

Lap Shear Min.

1400 psi9653 kPa

Elevated Temperature Cure Cycle Time

0.75 h at 212 °F (100 ºC)

RT Cure Time

24 h

Working Life

1 h

Shelf Life at RT (Mos.)

9

Recommended Primer

1086

Application

Bonding enclosures