
| Items |
C661 Foil-Copper Backing Substrates |
C665 Foil-Copper Backing Substrates |
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| Color | N/A Copper | |||
| Adhesive System | N/A A | |||
| Backing Thickness | N/A 1.5 mil0.038 mm | |||
| Adhesive Thickness | N/A 2.0 mil0.051 mm | |||
| Total Thickness | N/A 3.5 mil0.089 mm | |||
| Adhesion Strength | N/A 80 oz/in882 g/cm | N/A 35 oz/in386 g/cm | ||
| Tensile Strength | N/A 70 lb/in12.7 kg/cm | N/A 90 lb/in16.0 kg/cm | ||
| Elongation | N/A <16 % | N/A | ||
| Min Temperature Range | N/A -40 ºF-40 ºC | |||
| Max Temperature Range | N/A 250 ºF121 ºC | |||
| Comments | N/A UL Guide OANZ2, File E51201, UL510 | |||
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