
| Items |
C Film-FEP Backing Substrates |
2355-2 Film-FEP Backing Substrates |
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| Color | N/A Clear | |||
| Adhesive System | N/A S | |||
| Backing Thickness | N/A 2.0 mil0.051 mm | |||
| Adhesive Thickness | N/A 1.5 mil0.038 mm | |||
| Total Thickness | N/A 3.5 mil0.089 mm | |||
| Adhesion Strength | N/A 20 oz/in220 g/cm | |||
| Tensile Strength | N/A 8 lb/in1.4 kg/cm | |||
| Elongation | N/A 275 % | |||
| Dielectric | N/A 9.0 kV | |||
| Insulation Class | N/A 155 ºC | |||
| Min Temperature Range | N/A -100 ºF-73 ºC | |||
| Max Temperature Range | N/A 400 ºC204 ºF | |||
| Comments | N/A Food/Medical Grade | N/A | ||
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