Item # 1-4173 Adhesive, Dow Electronics Thermally Conductive Adhesives/Sealants On Robert McKeown Co., Inc.

Unit of Measure

Specifications | Features | Potential Uses | Application Methods

Type	N/A Thermally Conductive Adhesives
Product Form	N/A One-Part
Color	N/A Gray
Viscosity	N/A 58000 mPa/s
Durometer	N/A 92 A
Tensile Strength	N/A 900 psi6.2 MPa63.3 kgf/cm²
Elongation	N/A 20 %
Specific Gravity	N/A 2.7
Linear CTE	N/A 126 µ/mC
Heat Cure Time at 100 ºC (212 ºF)¹	N/A 90 min
Heat Cure Time at 125 ºC (257 ºF)²	N/A 30 min
Heat Cure Time at 150 ºC (302 ºF)³	N/A 20 min
Unprimed Adhesion Lap Shear	N/A 640 psi440 N/cm²45 kgf/cm²
Thermal Conductivity⁴	N/A 1.9 W/m·K
Shelf Life from Date of Manufacture	N/A 6 months at 5 ºC
Dielectric Strength	N/A 425 V/mil16.7 kV/mm
Dielectric Constant at 100 Hz	N/A 4.98
Dielectric Constant at 100 kHz	N/A 4.86
Dissipation Factor at 100 Hz	N/A 0.008
Dissipation Factor at 100 kHz	N/A < 0.003
Volume Resistivity	N/A 2.20E+14 O/cm

N/A
Rapid heat cure; high thermal conductivity

N/A
Bonding integrated circuit substrates; adhering lids and housings; base plate attach; heat sink attach

N/A
Automated or manual dispensing

¹ Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
² Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
³ Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
⁴ Thermal Conductivity at 25 ºC (77 ºF)

Type