Two-part; gray
Unit of Measure

Specifications

Type

N/A Thermally Conductive Adhesives

Product Form

N/A Two-Part

Color

N/A Gray

Viscosity

N/A 10000 mPa/s

Durometer

N/A 67 A

Tensile Strength

N/A 400 psi2.76 MPa28.1 kgf/cm²

Elongation

N/A 35 %

Specific Gravity

N/A 2.3

Compression Modulus at 10 %

N/A 125 psi

Linear CTE

N/A 179 µ/mC
Working Time at Room Temperature1 N/A 2 h
Room Temperature Cure Time2 N/A Material will cure after 24+ hours at room temperature, but requires heat cure for chemical bonding adhesion.
Heat Cure Time at 100 ºC (212 ºF)3 N/A 50 min
Heat Cure Time at 125 ºC (257 ºF)4 N/A 40 min
Heat Cure Time at 150 ºC (302 ºF)5 N/A 10 min

Unprimed Adhesion Lap Shear

N/A 555 psi383 N/cm²39.0 kgf/cm²
Thermal Conductivity6 N/A 1.1 W/m·K

Shelf Life from Date of Manufacture

N/A 12 months

Dielectric Strength

N/A 454 V/mil17.9 kV/mm

Dielectric Constant at 100 Hz

N/A 4.7

Dielectric Constant at 100 kHz

N/A 4.7

Dissipation Factor at 100 Hz

N/A 0.0045

Dissipation Factor at 100 kHz

N/A 0.00013

Volume Resistivity

N/A 7.20E+13 O/cm

Features

N/A
Low modulus; low viscosity; heat curable; UL94 V-0 rating

Potential Uses

N/A
Bonding heat sinks to electronics devices; bonding printed circuit boards to substrates

Application Methods

N/A
Manual or automated meter-mix and dispensing

  • 1 Time to double initial mixed viscosity.
  • 2 Cure time for 3 mm thickness at 20 °C (68 °F) and 55 % relative humidity.
  • 3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 4 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 5 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 6 Thermal Conductivity at 25 ºC (77 ºF)