One-part; gray
Unit of Measure

Specifications

Type

N/A Thermally Conductive Adhesives

Product Form

N/A One-Part

Color

N/A Gray

Viscosity

N/A 68700 mPa/s

Durometer

N/A 88 A

Tensile Strength

N/A 625 psi4.3 MPa43.9 kgf/cm²

Elongation

N/A 20 %

Specific Gravity

N/A 2.6

Linear CTE

N/A 137 µ/mC
Heat Cure Time at 100 ºC (212 ºF)1 N/A 60 min
Heat Cure Time at 125 ºC (257 ºF)2 N/A 45 min
Heat Cure Time at 150 ºC (302 ºF)3 N/A 10 min

Unprimed Adhesion Lap Shear

N/A 510 psi352 N/cm²35.9 kgf/cm²
Thermal Conductivity4 N/A 1.8 W/m·K

Shelf Life from Date of Manufacture

N/A 6 months

Dielectric Strength

N/A 395 V/mil15.6 kV/mm

Dielectric Constant at 100 Hz

N/A 5.6

Dielectric Constant at 100 kHz

N/A 5.5

Dissipation Factor at 100 Hz

N/A 0.0059

Dissipation Factor at 100 kHz

N/A < 0.0002

Volume Resistivity

N/A 6.85E+13 O/cm

Features

N/A
Rapid heat cure and primerless adhesion to common substrates used in the electronics industry; contains 7-mil (178 micron) glass beads for bond line control

Potential Uses

N/A
Bonding heat sinks to electronics devices; bonding printed circuit boards to substrates

Application Methods

N/A
Manual or automated dispensing

  • 1 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 2 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 4 Thermal Conductivity at 25 ºC (77 ºF)