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Our adhesive product line includes a series of one and two part room and thermal cure epoxy adhesives as well as UV curable adhesives. These adhesives are used in a wide range of applications meeting the customers' most demanding requirements: high strength at elevated temperatures, low stress for mismatched thermal expansion applications and outstanding chemical resistance for harsh environments.

Low CTE, excellent bond strength
Unit of Measure

Specifications

Type

 N/A Thermally Conductive

Catalyst

 N/A 11

Handling

Viscosity at 25 ºC

 N/A Paste

Mix Ratio (wt)

 N/A 100:4.0

Cure Schedule

 N/A Heat

Working Life at 25 ºC

 N/A > 4 h

Physical

Specific Gravity

 N/A 2.27 g/cc

Tensile Strength

 N/A 2100 psi

Thermal

Thermal Conductivity

 N/A 1.44 W/m·K

Glass Transition Temperature

 N/A 115 ºC

Service Temperature

 N/A –55 to 155 ºC

Electrical

Dielectric Strength

 N/A 450 V/mil

Volume Resistivity at 25 ºC

 N/A 1 x 1015 O/cm

Applications

N/A
Application considerations

Surface preparation: The first step in all adhesive applications. Substrate surfaces must be clean from dust, dirt and oils to maximize the adhesive bond strength.

Wetting: Essential to adhesive bonding. Gaps or bubbles in the bondline reduce the area of contact between the adhesive and substrate thus results in lower bond strengths.

Shrinkage: Adhesive shrinkage during cure may result in stresses at the interface leading to cracks. Flexible adhesives are better able to adjust to shrinkage induced stress than rigid systems.

Curing: Heat and room temperature cure adhesives are available to meet your application requirements of throughput and temperature ceilings.