Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

Low viscosity, high thermal conductivity, exce adhesion to gold
Unit of Measure

Max. Volume Resistivity

N/A 1 x 10-4 O/cm

Certified to MIL-STD-883, Method 5011

N/A Yes

Viscosity

N/A 22000 cps

Work Life at Room Temperature

N/A 2 weeks

Cure

N/A 1 h at 150 ºC

Secondary Cure Option

N/A 2 h at 125 ºC

Lap Shear Strength

N/A 1885 psi

Die Shear Strength

N/A 6600 psi

Conductivity

N/A 3.6 W/m·K

Tg

N/A 103 ºC

CTE Below Tg

N/A 52 ppm/ºC

CTE Above Tg

N/A 200 ppm/ºC